TUC delivers speed, reliability and value
with TU-872 LK/ SLK

The toughness enhanced by an allyl network forming compound in a patent pending technology.

- Dk 3.8; Df 0.009 @10GHz
- High Tg 200 °C/DSC; High Td 340°C/TGA and Survives 10X IR-reflow @260 °C
- Improved z-axis thermal expansion less than 2.5%

Halogen Free Materials

- Environmental friendly materials for lead-free processing compatible
- High thermal reliability and low z-axis thermal expansion
- For mobile communications,servers, base stations and office routers applications
- No-flow and mid-flow Prepreg for rigid-flex and IC Substrate (Cavities) applications

High Thermal Reliability Laminates

- Lead free processing compatible
- Excellent coefficient of thermal expansion
- For servers,base stations, Automotive and consumer
   electronics applications