TUC delivers speed, reliability and value
with TU-872 LK/ SLK

The toughness enhanced by an allyl network forming compound in a patent pending technology.

- Dk 3.8; Df 0.009 @10GHz
- High Tg 200 °C/DSC; High Td 340°C/TGA and Survives 10X IR-reflow @260 °C
- Improved z-axis thermal expansion less than 2.5%

 

Halogen Free Materials

- Environmental friendly materials for lead-free processing compatible
- High thermal reliability and low z-axis thermal expansion
- For mobile communications,servers, base stations and office routers applications
- No-flow and mid-flow Prepreg for rigid-flex and IC Substrate (Cavities) applications

 

High Thermal Reliability Laminates

- Lead free processing compatible
- Excellent coefficient of thermal expansion
- For servers,base stations, Automotive and consumer
   electronics applications

TUC Products:

2014-01-29

敬邀參觀 台燿科技攤位No. 1428

IPC APEX EXPO 2014
Booth No.: 1428
Date: March 25-27

台燿科技於1997年起成功轉型跨足銅箔基板(Copper Clad Laminate)與黏合片(Prepreg)之生產製造,持續提供全球電子產業所需的一流品質、服務及及高附加價值的基礎材料與多層壓合...

為了堅守品質穩定而可靠的產品,台燿科技堅持選用優良的原物料及製訂嚴謹的製造管理,並積極研發各項因應全球電子產業應用於手機板、基地台背板、通訊板、伺服器、汽車板等領域,具備...

為了提供整體及快捷有效之解決方案予遍及全球的客戶,台燿科技團隊集合印刷電路板及銅箔基板相關領域之資深經歷的專業人員,分別於台灣、中國、日本、南韓、台灣、美國及德國佈有服務據點...

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