ThunderClad 3+

Super Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-933+; Prepreg: TU-933P+

ThunderClad 3+ is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3+’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability.
ThunderClad 3+ laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

Main Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Excellent electrical and thermal properties
Dielectric constant is 3.16 @ 10GHz
Dissipation factor is 0.0021 @ 10GHz
Stable and flat Dk/Df performance over frequency and temperature variance.
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Superior dimensional stability, thickness uniformity and flatness
Anti-CAF capability
Excellent through-hole and soldering reliability
Property Typical Values
Tg (DMA) 220°C
Tg (DSC) 170°C
Td (TGA) 390°C
CTE z-axis (50 to 260 °C) 2.5%
T-260/ T288/ T300 > 60 min/ > 60 min/ > 60 min
Permittivity (RC 64%) @10GHz 3.16
Loss Tangent (RC 64%) @10GHz 0.0021
Industry Approvals
IPC-4101 Specification Number: /102
IPC-4101E/102 Validation Services QPL Certified
UL File Number: E189572
ANSI Grade: No-ANSI
Flammability Rating: 94V-0
Maximum Operating Temperature: 140°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
Prepregs: Available in roll or panel form
Glass Styles: 1035, 1078, 2116 and other prepreg grades are available upon request.
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