High Performance Materials with traditional FR-4 processability

TUC's lead free compatible products are RoHS compliant and survive lead free assembly with SnAgCu alloys at 260¢XC.
Proven in the assembly line and certified by major EMS providers, TUC base materials have low CTE, excellent dimensional stability, and are CAF resistant and cost effective.


TU-872 LK, TU-872 LK Sp ,TU-872 SLK ,TU-872 SLKSp

Application

High layer backpanels, high speed servers, high speed routing networks, base stations, WiMax and WiFi designs

Features

- Excellent electrical proprieties
- Stable and flat Dk/Df performance
- RoHS compliant, CAF resistant
- Lead free compatible
TUC Product TU-872 LK TU-872 LK Sp TU-872 SLK TU-872 SLK Sp
RoHS Compliance Yes Yes Yes Yes
Lead Free Compatible Yes Yes Yes Yes
Tg (DMA)
Tg (DSC)
Td (TGA)
220¢XC
200¢XC
340¢XC
220¢XC
200¢XC
340¢XC
220¢XC
200¢XC
340¢XC
220¢XC
200¢XC
340¢XC
CTE z-axis 2.5% 2.5% 2.3% 2.3%
T-260 60 min 60 min 60 min 60 min
Permittivity, 10GHz 3.8 3.5 3.8 3.5
Loss Tangent, 10GHz 0.009 0.008 0.009 0.008
  Data sheet Data sheet Data sheet Data sheet
 

TU-862 HF (High Tg), TU-742 HF (Mid Tg) ,TU-747 HF (Mid Tg)
TU-84P NF and MF (No-flow/Mid-flow prepreg)


Application

Mobile Communications, Rigid-flex Applications, IC Substrate (Cavities)

Features

- Halogen, antimony, and red phosphorous free
- Lead free compatible
- Compatible FR-4 processing characteristics
- Low CTE
TUC Product TU-742 HF TU-747 HF TU-862 HF
RoHS Compliance Yes Yes Yes
Halogen Free Material Yes Yes Yes
Tg (TMA)
Td (TGA)
150¢XC
370¢XC
150¢XC
360¢XC
170¢XC
390¢XC
CTE z-axis 3.1% 2.9% 2.1%
T-288 >60 min >60 min >60 min
Permittivity,1GHz 4.4 4.6 4.4
Loss Tangent,1GHz 0.010 0.011 0.010
  Data sheet Data sheet Data sheet

TUC Product TU-84P NF TU-84P MF
RoHS Compliance Yes Yes
Halogen Free Material Yes Yes
Tg (TMA)
Td (TGA)
165¢XC
390¢XC
165¢XC
390¢XC
CTE z-axis 2.1% 2.1%
T-288 >60 min >60 min
Permittivity,1GHz 4.4 4.4
Loss Tangent,1GHz 0.010 0.010
  Data sheet Data sheet
 

TU-322 (Insulated Metal Substrate Material)

Application

Heat dissipation for high-power LED lighting, back-light units, power modules, and chip packaging.

Features

- High thermal Dissipation and Durability
- Excellent circuit Integration
- High performance in reliability
- Good mechanical strength
TUC Product TU-322
RoHS Compliance Yes
Halogen Free Material Yes
Tg (DMA) 125¢XC
Thermal Conductivity 1.7~2.3 W/MK
Thermal Stress
Solder Float @288¢XC
Solder Float @300¢XC
>20 min
>5 min
Bending Test pass
RTI 90¢XC/90¢XC
Dielectric Breakdown
Strength
6KV (AC)
  Data sheet
 

TU-768, TU-752, TU-722 (High Tg)
TU-668, TU-662 (Mid Tg)


Application

High Tg: Backpanels, Line Cards, High Performance Computing, Servers, Base Stations, Automotive
Mid Tg: Routers, Consumer Electronics, Personal Computers, Notebooks/Netbooks, LCD

Features

- Lead free compatible
- Superior chemical and thermal resistance
- Excellent through-hole and soldering reliability

TUC Product TU-722 TU-752 TU-768
RoHS Compliance Yes Yes Yes
Lead Free Compatible Yes Yes Yes
Tg (DMA)
Tg (DSC)
Td (TGA)
185¢XC
175¢XC
330¢XC
190¢XC
180¢XC
350¢XC
190¢XC
180¢XC
350¢XC
CTE z-axis 3.5% 2.7% 2.7%
T-260 >30 min >60 min >60 min
Permittivity,1GHz 4.2 4.3 4.3
Loss Tangent,1GHz 0.016 0.019 0.019
  Data sheet Data sheet Data sheet
TUC Product TU-622-5 TU-662 TU-668
RoHS Compliance Yes Yes Yes
Lead Free Compatible Yes Yes Yes
Tg (DMA)
Tg (DSC)
Td (TGA)
155¢XC
145¢XC
310¢XC
160¢XC
150¢XC
340¢XC
160¢XC
150¢XC
340¢XC
CTE z-axis 4.1% 3.4% 3.4%
T-260 >20 min >60 min >60 min
Permittivity,1GHz 4.2 4.3 4.3
Loss Tangent,1GHz 0.015 0.014 0.014
  Data sheet Data sheet Data sheet

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