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High Performance Materials with traditional FR-4 processability
TUC's lead free compatible products are RoHS compliant and survive lead free assembly with SnAgCu alloys at 260¢XC.
Proven in the assembly line and certified by major EMS providers, TUC base materials have low CTE, excellent dimensional stability, and are CAF resistant and cost effective.
TU-872 LK, TU-872 LK Sp ,TU-872 SLK ,TU-872 SLKSp
Application
High layer backpanels, high speed servers, high speed routing networks, base stations, WiMax and WiFi designs
Features
- Excellent electrical proprieties
- Stable and flat Dk/Df performance
- RoHS compliant, CAF resistant
- Lead free compatible
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| TUC Product |
TU-872 LK |
TU-872 LK Sp |
TU-872 SLK |
TU-872 SLK Sp |
| RoHS Compliance |
Yes |
Yes |
Yes |
Yes |
| Lead Free Compatible |
Yes |
Yes |
Yes |
Yes |
Tg (DMA) Tg (DSC) Td (TGA) |
220¢XC 200¢XC 340¢XC |
220¢XC 200¢XC 340¢XC |
220¢XC 200¢XC 340¢XC |
220¢XC 200¢XC 340¢XC |
| CTE z-axis |
2.5% |
2.5% |
2.3% |
2.3% |
| T-260 |
60 min |
60 min |
60 min |
60 min |
| Permittivity, 10GHz |
3.8 |
3.5 |
3.8 |
3.5 |
| Loss Tangent, 10GHz |
0.009 |
0.008 |
0.009 |
0.008 |
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Data sheet |
Data sheet |
Data sheet |
Data sheet |
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TU-862 HF (High Tg), TU-742 HF (Mid Tg) ,TU-747 HF (Mid Tg) TU-84P NF and MF (No-flow/Mid-flow prepreg)
Application
Mobile Communications, Rigid-flex Applications, IC Substrate (Cavities)
Features
- Halogen, antimony, and red phosphorous free
- Lead free compatible
- Compatible FR-4 processing characteristics
- Low CTE
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| TUC Product |
TU-742 HF |
TU-747 HF |
TU-862 HF |
| RoHS Compliance |
Yes |
Yes |
Yes |
| Halogen Free Material |
Yes |
Yes |
Yes |
Tg (TMA) Td (TGA) |
150¢XC 370¢XC |
150¢XC 360¢XC |
170¢XC 390¢XC |
| CTE z-axis |
3.1% |
2.9% |
2.1% |
| T-288 |
>60 min |
>60 min |
>60 min |
| Permittivity,1GHz |
4.4 |
4.6 |
4.4 |
| Loss Tangent,1GHz |
0.010 |
0.011 |
0.010 |
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Data sheet |
Data sheet |
Data sheet |
| TUC Product |
TU-84P NF |
TU-84P MF |
| RoHS Compliance |
Yes |
Yes |
| Halogen Free Material |
Yes |
Yes |
Tg (TMA) Td (TGA) |
165¢XC 390¢XC |
165¢XC 390¢XC |
| CTE z-axis |
2.1% |
2.1% |
| T-288 |
>60 min |
>60 min |
| Permittivity,1GHz |
4.4 |
4.4 |
| Loss Tangent,1GHz |
0.010 |
0.010 |
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Data sheet |
Data sheet |
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TU-322 (Insulated Metal Substrate Material)
Application
Heat dissipation for high-power LED lighting, back-light units, power modules, and chip packaging.
Features
- High thermal Dissipation and Durability
- Excellent circuit Integration
- High performance in reliability
- Good mechanical strength
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| TUC Product |
TU-322 |
| RoHS Compliance |
Yes |
| Halogen Free Material |
Yes |
| Tg (DMA) |
125¢XC |
| Thermal Conductivity |
1.7~2.3 W/MK |
Thermal Stress Solder Float @288¢XC Solder Float @300¢XC |
>20 min
>5 min
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| Bending Test |
pass |
| RTI |
90¢XC/90¢XC |
Dielectric Breakdown Strength |
6KV (AC) |
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Data sheet |
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TU-768, TU-752, TU-722 (High Tg)
TU-668, TU-662 (Mid Tg)
Application
High Tg: Backpanels, Line Cards, High Performance Computing, Servers, Base Stations, Automotive
Mid Tg: Routers, Consumer Electronics, Personal Computers, Notebooks/Netbooks, LCD
Features
- Lead free compatible
- Superior chemical and thermal resistance
- Excellent through-hole and soldering reliability
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| TUC Product |
TU-722 |
TU-752 |
TU-768 |
| RoHS Compliance |
Yes |
Yes |
Yes |
| Lead Free Compatible |
Yes |
Yes |
Yes |
Tg (DMA) Tg (DSC) Td (TGA) |
185¢XC 175¢XC 330¢XC |
190¢XC 180¢XC 350¢XC |
190¢XC 180¢XC 350¢XC |
| CTE z-axis |
3.5% |
2.7% |
2.7% |
| T-260 |
>30 min |
>60 min |
>60 min |
| Permittivity,1GHz |
4.2 |
4.3 |
4.3 |
| Loss Tangent,1GHz |
0.016 |
0.019 |
0.019 |
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Data sheet |
Data sheet |
Data sheet |
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| TUC Product |
TU-622-5 |
TU-662 |
TU-668 |
| RoHS Compliance |
Yes |
Yes |
Yes |
| Lead Free Compatible |
Yes |
Yes |
Yes |
Tg (DMA) Tg (DSC) Td (TGA) |
155¢XC 145¢XC 310¢XC |
160¢XC 150¢XC 340¢XC |
160¢XC 150¢XC 340¢XC |
| CTE z-axis |
4.1% |
3.4% |
3.4% |
| T-260 |
>20 min |
>60 min |
>60 min |
| Permittivity,1GHz |
4.2 |
4.3 |
4.3 |
| Loss Tangent,1GHz |
0.015 |
0.014 |
0.014 |
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Data sheet |
Data sheet |
Data sheet |
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