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TU-747 LK

Mid. Tg Halogen Free Material
Core: TU-747 LK; Prepreg: TU-747P LK

TU-747 LK halogen free material is made of novel epoxy resin and regular E-glass fabric to achieve Dk 3.3 and Df 0.011 electrical performances than conventional halogen free FR-4. TU-747 LK targets the material for advanced mobile devices application which features short signal rising time, ultra thin dielectric thickness and excellent dimensional stability. TU-747 LK achieves flammability class of UL94V-0 by incorporating nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-747P LK is designed for use with TU-747 LK for making multilayer printed wire boards. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. TU-747 LK laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

Main Applications
  • Servers, Telecom, Base station
  • Office Routers
  • Mobile Communication
Key Features
  • Halogen, antimony and red phosphorous free
  • Environmental friendly materials
  • Compatible to PCB processes
  • Low coefficient of thermal expansion
  • Anti-CAF capability
Property Typical Values
TG(TMA) 150℃
Td(TGA) 360℃
CTE z-axis(50〜260℃) 2.8%
T-288 > 60min
Permittivity(RC 75%)@ 1GHz 3.3
Loss Tangent(RC 75%)@ 1GHz 0.011

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.1
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /127, /128
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz
  • Prepregs: Available in roll or panel form