Mass Lamination Service

台燿科技选用的尖端设备并结合铜箔基板制造专业与印刷电路板前段制程技术研究,专注发展阻抗控制、HDI及高层数预压技术等能力,持续提供全球印刷电路板业者更多方位的附加服务,不仅可提升PCB制造业者的产能弹性,并可分担其整体成本以提升竞争力。

TUC uses cutting edge equipment to provide mass lamination service to global PCB manufacturers – from image transfer to automatic build-up to optical inspection. Focusing on applications with impedance control, HDI-designs and high layer counts, TUC offers customers not only a total solution with CCL expertise and PCB inner layer processes, but also production flexibility and cost savings. Between TUC’s Taiwan and Changshu plants, total manufacturing capacity exceeds 2,400,000 square feet per month.

Process Capability
Min line width/space: 2/2 mils over H oz
Layer registration: 4 mils
Tooling hole distance: ± 2 mils
Min NC drilling size: 8 mils
NC drilling registration: 2 mils
Max working size: 23.8 x 27.8 inches
Min thickness: 10 mils (4L), 16 mils (6L), 22mils (8L), 28 mils (10L), 34 mils (12L)
Max thickness: 300 mils
Max layer count: 32 layers
Applications
≥18 layers PCB for servers, backpanels and base stations.
10~16 layers PCB for backpanels, base stations, switches, routers and servers.
6~8 layers PCB for DDR modules, HDD, LCD and graphics cards.
4 layers PCB for automotive, LCD applications, HDI designs and motherboards.
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