High Speed Digital (HSD)
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MORETUC strives to provide superior quality, professional support, value-added materials and advanced mass lamination service to the global electronics industry. With integrity, honesty and continuous innovation, TUC provides customers not only competitive pricing, but also quick response and delivery to maximize customer value.
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MOREDesigned for ELIC-Rigid-Flex & MSAP Process、25 um Dielectric Thickness、High Modulus & Toughenss BT-like Materials
LEARN MORE为配合欧美终端与PCB客户之分散供应计画,台燿科技于2022年11月1日董事会决议设立泰国子公司,拟进一步设立东南亚生产据点,于泰国东部经济走廊 (EEC) 春武里府建立一个占地 100-rai (16万平方公尺)的新厂。预计在2025年第一季完成投产,第一阶段目标CCL月产能为30万张,后续视客户订单状况及整体景气状况做动态调整,最大月产能可达90-120万张。
DETAILEvent: DesignCon 2025 Event Date: 2024-01-29~ 2025-01-30 Venue: Santa Clara Convention Center(Santa Clara, CA)
DETAILIPC's Validation Services Program has awarded an IPC-4103 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.
DETAILTUC provides quick global response and short lead time at competitive prices.
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