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TU-747 LK

TU-747 LK mid-Tg halogen free material is formulated with novel epoxy resin, non-PN (free phenolic group containing) curing agent and impregnated onto standard E-glass fabric to achieve Dk 3.3 and Df 0.011 electrical performances than conventional halogen free FR-4. TU-747 LK targets the material for advanced mobile devices application which features short signal rising time, ultra thin dielectric thickness and excellent dimensional stability. TU-747 LK achieves flammability class of UL94V-0 by incorporating nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-747P LK is designed for use with TU-747 LK for making multilayer printed wire boards. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. TU-747 LK laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

TU-862S

TU-862S High Tg halogen free Mid-loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with lower dielectric constant and dissipation factor for high speed mid-loss multilayer circuit server board applications. Unlike conventional FR-4.0 material using brominated resin as flame retardant. TU-862S achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. TU-862S material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, mid-loss signal attenuation and eliminate the use of potential hazardous halogenated resins.

TU-862 HF

TU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for use with TU-862 HF for making multilayer printed wire boards. TU-862 HF is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862 HF laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance.

TU-862T

TU-862T High Tg halogen free materials are made of High Tg epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862T /TU-862P T achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-862P T is designed for use with TU-862T for making multilayer printed wire boards. TU-862T is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862T laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance than conventional High Tg materials.

TU-865

TU-865 Tg200 material is made of epoxy resin and E-glass fabric. It’s a halogen free material and design to have both features for harsh environment, high reliability application and superior electrical performance at the same time. TU-865 achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds. The material is compatible with the AOI process and exhibit the UV-block characteristic. TU-865P is prepreg designed for use with TU-865 laminate for making multilayer printed wire boards. TU-865 is also available for single/double sided application. This series of green materials eliminate the use of halogenated resins with excellent performance due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycling, or to experience excessive assembly work. TU-865 laminates also exhibit superior chemical resistance, dimensional stability and moisture resistivity for lead free soldering assembly and CAF resistance.

TU-787 LK

TU-787 LK halogen free material is formulated with novel low Dk/Df epoxy resin, curing agent and impregnated onto standard E-glass fabric to achieve low loss category high performances material. TU-787 LK targets the material for advanced mobile devices application which features short signal rising time, ultra-thin dielectric thickness, excellent dimensional stability and high material modulus. TU-787P LK prepreg is designed for use with TU-787 LK laminate for making multilayer printed wire boards. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. TU-787 LK laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

ThunderClad 1

ThunderClad 1 High Tg halogen free low loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. Unlike conventional low loss material using brominated resin as flame retardant. ThunderClad 1 achieves flammability class of UL94V-0 by incorporating nitrogen compounds in the materials. ThunderClad 1 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resins.

ThunderClad 1+

ThunderClad 1+ High Tg halogen free low loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board applications. Unlike conventional low loss material using brominated resin as flame retardant. ThunderClad 1+ achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. ThunderClad 1+ material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resins.

TU-872 SLK Sp

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

ThunderClad 2

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
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