ThunderClad 1+

Hi-Tg Halogen free Low Loss laminate and prepreg
Core: TU-863+ ; Prepreg: TU-863P+

ThunderClad 1+ FR -15.1 High Tg / MOT150 halogen free low loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board applications. Unlike conventional low loss material using brominated resin as flame retardant. ThunderClad 1+ FR -15.1 achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. ThunderClad 1+ FR -15.1 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resins.

Main Applications
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Halogen, antimony, and red phosphorous free
Low Dk & Df performance
Lead free process compatible
Environmental friendly materials
Compatible to PCB processes
Low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Higher Tg thermal robust characteristics
Property Typical Values
Tg (DMA) 210°C
Tg (DSC) 180°C
Tg (TMA) 170°C
Td (TGA) 375°C
CTE z-axis (50 to 260 °C) 2.2%
T-260/ T288 >60 min/ >60 min
Permittivity (RC 50%) @10GHz 4.0
Loss Tangent (RC 50%) @10GHz 0.007
Industry Approvals
IPC-4101 Type Designation : /127, /128, /130
IPC-4101E/130
UL Designation - ANSI Grade: FR-15.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 150°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides and H to 2 oz
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 3313, 2116 etc and other prepreg grades are available upon request
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