High Speed Digital (HSD)
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MORETUC strives to provide superior quality, professional support, value-added materials and advanced mass lamination service to the global electronics industry. With integrity, honesty and continuous innovation, TUC provides customers not only competitive pricing, but also quick response and delivery to maximize customer value.
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MOREDesigned for ELIC-Rigid-Flex & MSAP Process、25 um Dielectric Thickness、High Modulus & Toughenss BT-like Materials
LEARN MOREEvent: CPCA Show 2021 Event Date: 2021-07-07 ~ 2021-07-09 Venue: National Exhibition and Convention Center (Shanghai)
DETAILEvent: HKPCA Show 2020 Event Date: 2020-12-02 ~ 2020-12-04 Venue: Shenzhen Convention & Exhibition Center, China
DETAILTaiwan Union Technology Corporation successfully completed intensive audit based on IPC’s foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards
DETAILTUC provides quick global response and short lead time at competitive prices.
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