High Speed Digital (HSD)
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MOREDelivering Value through Innovation and Dedication
TUC strives to provide superior quality, professional support, value-added materials and advanced mass lamination service to the global electronics industry. With integrity, honesty and continuous innovation, TUC provides customers not only competitive pricing, but also quick response and delivery to maximize customer value.
High Density Interconnect (HDI)
Designed for ELIC-Rigid-Flex & MSAP Process、25 um Dielectric Thickness、High Modulus & Toughenss BT-like Materials
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See TUC at Booth No. 8L50
Event: CPCA Show 2021 Event Date: 2021-07-07 ~ 2021-07-09 Venue: National Exhibition and Convention Center (Shanghai)
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See TUC at Booth No. 2K41
Event: HKPCA Show 2020 Event Date: 2020-12-02 ~ 2020-12-04 Venue: Shenzhen Convention & Exhibition Center, China
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TUC Receives First IPC-4101 QPL Certification
Taiwan Union Technology Corporation successfully completed intensive audit based on IPC’s foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards
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TUC provides quick global response and short lead time at competitive prices.
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