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ThunderClad 2 Sp

ThunderClad 2 Sp ( TU-883 Sp ) is a very low loss category material based on a high performance resin. This material is reinforced with low Dk woven glass fabric and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 Sp laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

ThunderClad 3

ThunderClad 3 is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability. ThunderClad 3 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

ThunderClad 3+

ThunderClad 3+ is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3+’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability. ThunderClad 3+ laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

TU-872 SLK

TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 SLK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.

TU-872 LK

TU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 LK laminates also exhibit excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.
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