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ThunderClad 200G

ThunderClad 200G ( TU-885 ) is a very low loss category material based on a high performance modified FR-4 resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 200G material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 200G laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

TU-901

TU-901 Tg260 material is made of high performance robust resin system and E-glass fabric. It’s a halogen free material and designed to have high modulus, thermal robust, low Dk/Df, low CTE and ultra-low insertion loss features at the same time. TU-901 laminate and TU-901P prepreg are designed to achieve high reliability multilayer, substrate, SiP, radio frequency and ultra-thin HDI boards design and applications. The product is suitable for boards that need stringent X, Y dimensional stability, low board distortion or need to experience excessive harsh environmental work with excellent signal integrity performance. TU-901 materials also exhibit superior chemical resistance, high rigidity, PCB process friendly, excellent long term reliability and CAF performance.

ThunderClad 3E

ThunderClad 3E / TU-933E is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3E’s electrical performance is competitive with hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability. ThunderClad 3E laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

ThunderClad 2C

ThunderClad 2C ( TU-883C ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

TU-900

TU-900 Tg260 material is made of BT-like high performance resin system and E-glass fabric. It’s a halogen free material and design to have both features for high elastic modulus, high reliability and low Dk/Df, low loss category electrical performance at the same time. TU-900 laminate and TU-900P prepreg designed for high reliability multilayer, substrate or, SiP, radio frequency and ultra-thin HDI boards design and applications. The product is suitable for boards that need stringent X, Y dimensional stability, low board distortion or need to experience excessive harsh environmental work. TU-900 materials also exhibit superior chemical resistance, high rigidity, low thermal expansion and excellent long term reliability and CAF performance.

ThunderClad 2A

ThunderClad 2A ( TU-883A ) is a very low loss category material based on a high performance modified FR-4 resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2A material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2A laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

ThunderClad 2A Sp

ThunderClad 2A Sp ( TU-883A Sp ) is a super low loss category material based on a high performance resin. This material is reinforced with low Dk woven glass fabric and designed with super low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2A Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2A Sp laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

PegaClad 1

PegaClad 1 is an advanced material designed for high frequency very low loss field applications. PegaClad 1’s electrical performance is competitive with hydrocarbon-based very low loss materials, but capable for multi-layer count circuit board design with excellent thermal reliability. PegaClad 1 is suitable for RF/microwave printed circuit board designs. PegaClad 1 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

PegaClad 2

PegaClad 2 is an advanced material designed for high frequency super low loss field applications. PegaClad 2’s electrical performance is competitive with PTFE laminate materials, but capable for multi-layer count circuit board design with excellent thermal reliability. PegaClad 2 is suitable for RF/microwave printed circuit board designs. PegaClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

TU-722

TU-722/TU-72P laminate/ prepreg offer enhanced thermal resistance and also provide UV-block characteristic and compatibility with AOI process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. The lower Z-axis thermal expansion also minimizes the problems, such as lifted pads and barrel cracks. TU-722 laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and with general CAF resistance property.
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