Hi-Tg Halogen Free Mid-Loss Material
Core: TU-862S; Prepreg: TU-862P S

TU-862S High Tg halogen free Mid-loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with lower dielectric constant and dissipation factor for high speed mid-loss multilayer circuit server board applications. Unlike conventional FR-4.0 material using brominated resin as flame retardant. TU-862S achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. TU-862S material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, mid-loss signal attenuation and eliminate the use of potential hazardous halogenated resins.

Main Applications
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Lower Dk & Df performance, mid-loss applications
Lead free process compatible
Environmental friendly materials
Compatible to PCB processes
Low coefficient of thermal expansion
Moisture resistance
Anti-CAF capability
Property Typical Values
TG (DMA) 200°C
TG (TMA) 165°C
Td (TGA) 370°C
CTE z-axis (50 to 260 °C) 2.2%
T-260/ T288 >60 min/ >60 min
Permittivity (RC 50%) @1GHz 4.3
Loss Tangent (RC 50%) @1GHz 0.011
Industry Approvals
IPC-4101 Type Designation: /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 4 oz for built-up & double sides
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 3313, 2116 etc and other prepreg grades are available upon request