TU-747 LK

Mid. Tg Halogen Free Material
Core: TU-747 LK; Prepreg: TU-747P LK

TU-747 LK mid-Tg halogen free material is formulated with novel epoxy resin, non-PN (free phenolic group containing) curing agent and impregnated onto standard E-glass fabric to achieve Dk 3.3 and Df 0.011 electrical performances than conventional halogen free FR-4. TU-747 LK targets the material for advanced mobile devices application which features short signal rising time, ultra thin dielectric thickness and excellent dimensional stability. TU-747 LK achieves flammability class of UL94V-0 by incorporating nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-747P LK is designed for use with TU-747 LK for making multilayer printed wire boards. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. TU-747 LK laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

Main Applications
Servers, Telecom, Base station
Office Routers
Mobile Communication
Key Features
Halogen, antimony and red phosphorous free
Halogen, antimony, PN (phenolic group) resin and red phosphorous free
Low and stable Dk/Df
Ultra thin core and prepreg design
Superior dimensional stability
Compatible to PCB processes
Low coefficient of thermal expansion
High modulus properties
Property Typical Values
TG (TMA) 150°C
Td (TGA) 360°C
CTE z-axis (50 to 260 °C) 2.8%
T288 >60 min
Permittivity (RC 75%) @1GHz 3.3
Loss Tangent (RC 75%) @1GHz 0.011
Industry Approvals
IPC-4101 Type Designation : /127, /128
UL Designation - ANSI Grade: FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5oz
Prepregs: Available in roll or panel form
Glass Styles: 1027, 1037, 1067, 1078, 3313, etc.