Mid-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-662; Prepreg: TU-66P

TU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

Main Applications
Consumer Electronics
Key Features
Lead Free process compatible
Excellent coefficient of thermal expansion
Anti-CAF property
Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear
Superior chemical and thermal resistance
Fluorescence for AOI
Optical characteristics provide UV-block property
High interlayer bonding strength with optimum resin flow
Low moisture absorption
Property Typical Values
Tg (DMA) 160°C
Tg (DSC) 150°C
Tg (TMA) 140°C
Td (TGA) 340°C
CTE z-axis (50 to 260 °C) 3.2%
T-260/ T288 >60 min/ >10 min
Permittivity (RC 50%) @1GHz 4.3
Loss Tangent (RC 50%) @1GHz 0.014
Industry Approvals
IPC-4101 Type Designation : /21, /98, /99, /101
UL Designation - ANSI Grade: FR-4.0
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 6oz (HTE) for built-up; 1/3 to 3oz (HTE) for double sides and H to 2oz (MLS)
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.