PegaClad Series

Very Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-1300; Prepreg: TU-1300P

PegaClad Series is an advanced material designed for Sub6G antenna application. It comprises Dk_3.38, Dk_3.45 and Dk_3.65, to meet most of the antenna deigned application.
PegaClad Series is an advanced material designed for low PIM requirement and meet the antenna designer’s need. It is an advanced hydrocarbon-based very low loss material, and it is capable for multi-layer circuit board design with excellent thermal reliability. PegaClad Series is the solution for double side and multi-layer radio frequency designs.
PegaClad Series laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

Main Applications
Sub6G antenna
Automotive radars and sensors
Base Station Antenna
Key Features
Excellent electrical and thermal properties
Dielectric constant is 3.38, 3.45, 3.65 ± 0.05 @ 10GHz
Stable and flat Dk/Df performance over frequency and temperature variance.
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Superior dimensional stability, thickness uniformity and flatness
Excellent through-hole and soldering reliability
Property Typical Values
Tg (DMA) 220°C
Td (TGA) 390°C
CTE-x,y, α1 13-16
CTE-z, α1 35
T-260/ T288/ T300 > 60 min/ > 60 min/ > 60 min
Permittivity @10GHz 
3.38/ 3.45/ 3.65
Loss Tangent  @10GHz
0.0032/ 0.0034/ 0.0036
Industry Approvals
UL File Number: E189572
ANSI Grade: non-ANSI
Flammability Rating: 94V-0
Maximum Operating Temperature: 140°C
UL Registration Product Code : TU-1300 / TU-1300P
Standard Availability
Thickness: 0.0020” [0.508 mm], 0.0030” [0.762mm], 0.0060” [1.524mm] in panel form
Copper Foil Cladding : 1/2 and 1 oz with RTF , VLP or HVLP type
Prepregs : 1078, 1086, 3313 prepreg types available in panel form