ThunderClad 5N

Extreme Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-953N; Prepreg: TU-953P N

TU-953N is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. TU-953N electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability.
TU-953N laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

Main Applications
Al Servers, Networking
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Excellent electrical and thermal properties
Dielectric constant is 3.21 @ 10GHz
Dissipation factor is 0.00113 @ 10GHz
Stable and flat Dk/Df performance over frequency and temperature variance.
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Superior dimensional stability, thickness uniformity and flatness
Anti-CAF capability
Excellent through-hole and soldering reliability
Halogen Free
Property Typical Values
Tg (DMA) 200°C
Td (TGA) 430°C
CTE x/y axis 7/8 ppm/°C%
CTE z-axis  1.5%
T-260/ T288/ T300 > 60 min/ > 60 min/ > 60 min
Permittivity (RC 70%) @10GHz 3.21
Loss Tangent (RC 70%) @10GHz 0.00113
Industry Approvals
IPC-4101E Specification Number : /134
UL File Number: E189572
ANSI Grade: No-ANSI
Flammability Rating: 94V-0
Maximum Operating Temperature: 170°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.028” [0.71mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 2 oz for built-up & double sides
Prepregs: Available in roll or panel form
Glass Styles: 1035, 1078,2116 and other prepreg grades are available upon request
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