TU-747 HF

Mid. Tg Halogen Free Material
Core: TU-747 HF; Prepreg: TU-747P HF

TU-747 HF/TU-747P HF halogen free materials are formulated with epoxy resin, non-PN (free phenolic group containing) curing agent and impregnated onto standard E-glass fabric. Unlike conventional FR-4 materials where brominated resin is uses as flame retardant, TU-747 HF/TU-747P HF achieves the flammability class of UL94V-0 by incorporating nitrogen compounds into the resin formulation. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. The UV-block characteristic of the materials is compatible with the standard AOI process. TU-747P HF is uses with TU-747 HF for making multilayer printed wire boards. TU-747 HF is also available for single/double sided application. TU-747 HF laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

Main Applications
Servers, Telecom, Base station
Office Routers
Mobile Communication
Key Features
Halogen, antimony, PN (phenolic group) resin and red phosphorous free
Environmental friendly materials
Compatible to PCB processes
Low coefficient of thermal expansion
Lower Df, better stability of Dk & Df
Lower moisture absorption
Excellent thermal resistant for lead-free process
Anti-CAF capability
Property Typical Values
Tg (TMA) 150°C
Td (TGA) 360°C
CTE z-axis (50 to 260 °C) 2.9%
T288 >60 min
Permittivity (RC 75%) @1GHz 3.6
Loss Tangent (RC 75%) @1GHz 0.012
Industry Approvals
IPC-4101 Type Designation : /127, /128
UL Designation - ANSI Grade: FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5oz
Prepregs: Available in roll or panel form
Glass Styles: 1027, 1037, 1067, 1078, 106, 1080, 2113 and 2116 etc.