- Main Applications
- Rigid-flex
- Heat sink, Cavity
- Products
- High Speed Digital (HSD)
- TU-84P MF
TU-84P MF
High-Tg Halogen Free Medium Flow Prepreg
Prepreg: TU-84P MF
TU-84P MF medium flow, halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding application. The special design TU-84P MF medium flow, halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board application. TU-84P MF medium flow prepreg also provide excellent bonding performance with a variety of polyimide materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.
- Key Features
- Stable resin flow and resin filling capability
- Excellent bonding strength with polyimide materials
- Low resin powder dust generation
- Higher Tg and halogen free characteristics
- Lead Free process compatible
- Reduced Z-axis thermal expansion
- Superior dimensional stability, thickness uniformity and flatness
- Good drilling & lamination processes friendly
- Superior dielectric thickness control
Property | Typical Values |
---|---|
Tg (DMA) | 190°C |
Tg (TMA) | 165°C |
Td (TGA) | 390°C |
CTE z-axis (50 to 260 °C) | 2.1% |
T-260/ T288 | >60 min/ >60min |
Permittivity (RC 50%) @1GHz | 4.4 |
Loss Tangent (RC 50%) @1GHz | 0.010 |
- Industry Approvals
- IPC-4101 Type Designation : /127, /128, /130
- IPC-4101E/130 Validation Services QPL Certified
- UL Designation - ANSI Grade: FR-4.1
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
- Standard Availability
- Prepregs: Available in roll or panel form
- Glass Styles: 106 and 1080, other prepreg grades are available upon request
Document Downloads For Public
- TU-84P MF_Datasheet.pdf
Document Downloads For Member
- TU-84P MF_RoHS of Prepreg.pdf
- TU-84P MF_SDS of Prepreg.pdf