- Main Applications
- Automotive
- Consumer Electronics
- Products
- High Speed Digital (HSD)
- TU-662F
TU-662F
Mid-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-662 F; Prepreg: TU-66P F
TU-662 F laminate / prepreg materials made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 F laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.
- Key Features
- Lead Free process compatible
- Excellent coefficient of thermal expansion ( CTE )
- Anti-CAF property
- Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear
- Superior chemical and thermal resistance
- Fluorescence for AOI
- Optical characteristics provide UV-block property
- High interlayer bonding strength with optimum resin flow
- Low moisture absorption
Property | Typical Values |
---|---|
Tg (DMA) | 165°C |
Tg (DSC) | 155°C |
Tg (TMA) | 145°C |
Td (TGA) | 345°C |
CTE z-axis (50 to 260 °C) | 2.8% |
T-260/ T288 | >60 min/ >20min |
Permittivity (RC 50%) @1GHz | 4.7 |
Loss Tangent (RC 50%) @1GHz | 0.018 |
- Industry Approvals
- IPC-4101 Type Designation : /21, /98, /99, /101
- UL Designation - ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130 ℃
- Standard Availability
- Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/3 to 6 oz (HTE) for built-up; 1/3 to 3 oz (HTE) for double sides and H to 2 oz (MLS)
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.
Document Downloads For Public
- TU-662F_Datasheet.pdf