- Main Applications
- Radio frequency
- mmWave
- Automotive radars and sensors
- Base station antenna
- Products
- Radio Frequency (RF)
- PegaClad 1
PegaClad 1
Very Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-1300E; Prepreg: TU-1300P E
PegaClad 1 is an advanced material designed for high frequency very low loss field applications. PegaClad 1’s electrical performance is competitive with hydrocarbon-based very low loss materials, but capable for multi-layer count circuit board design with excellent thermal reliability. PegaClad 1 is suitable for RF/microwave printed circuit board designs.
PegaClad 1 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.
- Key Features
- Excellent electrical and thermal properties
- Dielectric constant is 3.44 @ 10GHz
- Dissipation factor is 0.0034 @ 10GHz
- Stable and flat Dk/Df performance over frequency and temperature variance.
- Compatible with modified FR-4 processes
- Excellent moisture resistance and Lead Free reflow process compatible
- Improved z-axis thermal expansion
- Superior dimensional stability, thickness uniformity and flatness
- Excellent through-hole and soldering reliability
Property | Typical Values |
---|---|
Tg (DMA) | 220°C |
Td (TGA) | 390°C |
CTE-x,y, α1 | 15-17 |
CTE-z, α1 | 35 |
T-260/ T288/ T300 | > 60 min/ > 60 min/ > 60 min |
Permittivity (4 mil core) @10GHz | 3.44 |
Loss Tangent (4 mil core) @10GHz | 0.0034 |
- Industry Approvals
- IPC-4103 Specification Number :/17
- IPC-4103/17 Validation Services QPL Certified
- UL File Number: E189572
- ANSI Grade: non-ANSI
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 140°C
- Standard Availability
- Thickness: 0.004” [0.1mm] to 0.030” [0.762mm], available in sheet or panel form
- Copper Foil Cladding: 1/2 to 2 oz for built-up & double sides
- Prepregs: Available in panel form
Document Downloads For Public
- PegaClad 1_Datasheet.pdf