Tg 280°C Halogen Free Laminate and Prepreg
Core: TU-901; Prepreg: TU-901P

TU-901 Tg280 material is made of high performance robust resin system and E-glass fabric. It’s a halogen free material and designed to have high modulus, thermal robust, low Dk/Df, low CTE and ultra-low insertion loss features at the same time. TU-901 laminate and TU-901P prepreg are designed to achieve high reliability multilayer, substrate, SiP, radio frequency and ultra-thin HDI boards design and applications. The product is suitable for boards that need stringent X, Y dimensional stability, low board distortion or need to experience excessive harsh environmental work with excellent signal integrity performance. TU-901 materials also exhibit superior chemical resistance, high rigidity, PCB process friendly, excellent long term reliability and CAF performance.

Main Applications
HDI, ELIC Design
High speed / frequency applications
Aerospace & Military –Harsh environments
Key Features
Ultra-High Tg characteristics
Ultra-Low insertion loss material
Low coefficient of X/Y/Z thermal expansion
Excellent resin filling capability for thin dielectric thickness design
Lead free and modified FR4 processes compatible
Halogen free environmental friendly material
Property Typical Values
Tg (DMA) 280°C
Tg (TMA) 230°C
Td (TGA) 430°C
CTE z-axis (50 to 260 °C) 1.0%
T-260/ T288/ T300 > 60 min/ > 60 min/ > 30 min
Permittivity (RC 70%) @10GHz 3.5
Loss Tangent (RC 70%) @10GHz 0.0038
Industry Approvals
IPC-4101 Type Designation : /127, /128, /130
UL File Number: E189572
ANSI Grade: non-ANSI
Flammability Rating: 94V-0
Maximum Operating Temperature: 160°C
Standard Availability
Thickness: 0.0012” [0.03mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil cladding: 1/3 to 3 oz
Prepregs: Available in roll or panel form
Glass Styles: 1017, 1027, 1037, 1067, 1078, 3313 and 2116 etc. and others upon request