PegaClad 300

Super Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-1400; Prepreg: TU-1400P

PegaClad 300 (Dk_3.0) designed for Antenna and Low-orbit satellites applications. It is an advanced hydrocarbon-based very low loss material, and capable for multi-layer circuit board design with excellent thermal reliability. PegaClad 300 is the solution for double side and multilayer radio frequency designs.
PegaClad 300 material also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

Main Applications
Antenna
Low-orbit satellites
Key Features
Excellent electrical and thermal properties
Dielectric constant is 3.05 @ 10GHz (IPC-2.5.5.5 Method)
Stable and flat Dk/Df performance over frequency and temperature variance.
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Superior dimensional stability, thickness uniformity and flatness
Excellent through-hole and soldering reliability
Property Typical Values
Tg (DMA) 210°C
Td (TGA) 400°C
CTE-x,y, α1, RC50% 13
CTE-z, α1, RC50% 40
T-260/ T288/ T300 > 60 min/ > 60 min/ > 60 min
Permittivity @ 10GHz RC77% 3.05
Loss Tangent @ 10GHz RC77% 0.0018
Industry Approvals
UL File Number: E189572
ANSI Grade: non-ANSI
Flammability Rating: 94V-0
Maximum Operating Temperature: 140°C
Standard Availability
Thickness: 0.020”, 0.030” and 0.060”, available in sheet or panel form
Copper Foil Cladding : 1/2 and 1 oz for built-up & double sides
Prepreg glass Styles: 1027, 1037, 1067 and 1078 types available in roll or panel form.
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