TU-901 (T)

Ultra Low Loss and High Thermal Reliability
Low Z, X/Y CTE
Tg 240°C Halogen Free Laminate and Prepreg
Core: TU-901 (T); Prepreg: TU-901P (T)

TU-901 (T) Tg240 material is made of high performance robust resin system and E-glass fabric. It’s a halogen free material and designed to have high modulus, thermal robust, low Dk/Df, low CTE and ultra-low insertion loss features at the same time. TU-901 (T) laminate and TU-901P (T) prepreg are designed to achieve high reliability multilayer, substrate, SiP, radio frequency and ultra-thin HDI boards design and applications. The product is suitable for boards that need stringent X, Y dimensional stability, low board distortion or need to experience excessive harsh environmental work with excellent signal integrity performance. TU-901 (T) materials also exhibit superior chemical resistance, high rigidity, PCB process friendly, excellent long term reliability and CAF performance.

Main Applications
Substrate
HDI, ELIC Design
High speed / frequency applications
Aerospace & Military –Harsh environments
Key Features
Ultra-High Tg characteristics
Ultra-Low insertion loss material
Low coefficient of X/Y/Z thermal expansion
Excellent resin filling capability for thin dielectric thickness design
Lead free and modified FR4 processes compatible
Halogen free environmental friendly material
Property Typical Values
Tg (DMA) 240°C
Tg (TMA) 180°C
Td (TGA) 430°C
CTE x/y axis* 6/8 ppm/°C
CTE z-axis (50 to 260 °C) 0.8%
T-260/ T288/ T300 > 60 min/ > 60 min/ > 30 min
Permittivity (RC 70%) @10GHz 3.64
Loss Tangent (RC 70%) @10GHz 0.0034
Industry Approvals
IPC-4101E Specification Number : /134
UL File Number : E189572
ANSI Grade : N/A
Flammability Rating: 94V-0
Maximum Operating Temperature: 160°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.020” [0.51mm], available in sheet or panel form
Copper Foil cladding: 1/3 to 3 oz
Prepregs: Available in roll or panel form
Glass Styles: 1027, 1067, 1078, 3313 and 2116 etc. and others upon request
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