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PegaClad 1

PegaClad 1 is an advanced material designed for high frequency very low loss field applications. PegaClad 1’s electrical performance is competitive with hydrocarbon-based very low loss materials, but capable for multi-layer count circuit board design with excellent thermal reliability. PegaClad 1 is suitable for RF/microwave printed circuit board designs. PegaClad 1 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

PegaClad 2

PegaClad 2 is an advanced material designed for high frequency super low loss field applications. PegaClad 2’s electrical performance is competitive with PTFE laminate materials, but capable for multi-layer count circuit board design with excellent thermal reliability. PegaClad 2 is suitable for RF/microwave printed circuit board designs. PegaClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and also compatible with modified FR-4 processes.

TU-722

TU-722/TU-72P laminate/ prepreg offer enhanced thermal resistance and also provide UV-block characteristic and compatibility with AOI process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. The lower Z-axis thermal expansion also minimizes the problems, such as lifted pads and barrel cracks. TU-722 laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and with general CAF resistance property.

TU-668

TU-668/ TU-668P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-668 laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

TU-662F

TU-662 F laminate / prepreg materials made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 F laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

TU-662

TU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

TU-768F

TU-768 F/ TU-768P F laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 F laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

TU-768

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

TU-84P MF

TU-84P MF medium flow, halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding application. The special design TU-84P MF medium flow, halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board application. TU-84P MF medium flow prepreg also provide excellent bonding performance with a variety of polyimide materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.

TU-84P NF

TU-84P NF no-flow, halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding application. The special design TU-84P NF no-flow, halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board application. TU-84P NF no-flow prepreg also provide excellent bonding performance with a variety of polyimide materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.
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