High Speed Digital (HSD)
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MORETUC strives to provide superior quality, professional support, value-added materials and advanced mass lamination service to the global electronics industry. With integrity, honesty and continuous innovation, TUC provides customers not only competitive pricing, but also quick response and delivery to maximize customer value.
A Variety of Material Solutions for High Speed Digital Applications、10Gbps/ 28Gbps/ 56Gbps/ 112Gbps、Lower Disspation Foctor < Df 0.0013、Designed for High Layer Count, Hybrid Design, RigidFlex, HDI & Thick Copper
LEARN MOREDesigned for ELIC-Rigid-Flex & MSAP Process、25 um Dielectric Thickness、High Modulus & Toughenss BT-like Materials
LEARN MORE為配合歐美終端與PCB客戶之分散供應計畫,台燿科技於2022年11月1日董事會決議設立泰國子公司,擬進一步設立東南亞生產據點,於泰國東部經濟走廊 (EEC) 春武里府建立一個佔地 100-rai (16萬平方公尺)的新廠。預計在2025年第一季完成投產,第一階段目標CCL月產能為30萬張,後續視客戶訂單狀況及整體景氣狀況做動態調整,最大月產能可達90-120萬張。
DETAILEvent: DesignCon 2025 Event Date: 2024-01-29~ 2025-01-30 Venue: Santa Clara Convention Center(Santa Clara, CA)
DETAILIPC's Validation Services Program has awarded an IPC-4103 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.
DETAILTUC provides quick global response and short lead time at competitive prices.
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