Mass Lamination Service

台燿科技選用的尖端設備並結合銅箔基板製造專業與印刷電路板前段製程技術研究,專注發展阻抗控制、HDI及高層數預壓技術等能力,持續提供全球印刷電路板業者更多方位的附加服務,不僅可提昇PCB製造業者的產能彈性,並可分擔其整體成本以提升競爭力。

TUC uses cutting edge equipment to provide mass lamination service to global PCB manufacturers – from image transfer to automatic build-up to optical inspection. Focusing on applications with impedance control, HDI-designs and high layer counts, TUC offers customers not only a total solution with CCL expertise and PCB inner layer processes, but also production flexibility and cost savings. Between TUC’s Taiwan and Changshu plants, total manufacturing capacity exceeds 2,400,000 square feet per month.

Process Capability
Min line width/space: 2/2 mils over H oz
Layer registration: 4 mils
Tooling hole distance: ± 2 mils
Min NC drilling size: 8 mils
NC drilling registration: 2 mils
Max working size: 23.8 x 27.8 inches
Min thickness: 10 mils (4L), 16 mils (6L), 22mils (8L), 28 mils (10L), 34 mils (12L)
Max thickness: 300 mils
Max layer count: 32 layers
Applications
≥18 layers PCB for servers, backpanels and base stations.
10~16 layers PCB for backpanels, base stations, switches, routers and servers.
6~8 layers PCB for DDR modules, HDD, LCD and graphics cards.
4 layers PCB for automotive, LCD applications, HDI designs and motherboards.
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