Base material consideration for high speed printed circuit boards

Date2009-09-30

Event: Impact & TPCA Show 2009
Venue: 台北南港展覽館5樓(504a室)

Impact & TPCA Show 2009

Session 18: Green Materials & Assembly I
Presented Dates：2009-10-23 10:50~ 11:10
Author: Annie Liu/ Eric Liao

Abstract

To take our responsibility of reducing harm to our environment, EU RoHS restriction about lead-free capability is one of considered tasks for us to follow up. Additionally, the tendency shows that more and more demands of the higher signal transmission speed in various field of applications, and the demand of frequency shifts from 1-5 Gbps range to 5-10 Gbps depending on the applications. Recently the material improvement on lead-free process favored and better signal integrity performed laminate materials seems to be critical and sensitive to choose a moderate resin system. Considering the electrical, thermal performances and the cost effectiveness, we discuss the resulted performance from the point of view of laminate composition, such as resin, laminate construction, and some environment factors etc. combined with a massive mainstream application and low-loss application under the hypothesis of lead-free capability.