High-Tg Halogen Free No-flow Prepreg
Prepreg: TU-84P NF

TU-84P NF no-flow, halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding application. The special design TU-84P NF no-flow, halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board application. TU-84P NF no-flow prepreg also provide excellent bonding performance with a variety of polyimide materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.

Main Applications
Heat sink, Cavity
Key Features
Stable resin flow
Excellent bonding strength with polyimide materials
Low resin powder dust generation
Higher Tg and halogen free characteristics
Lead Free process compatible
Reduced z-axis thermal expansion
Superior dimensional stability, thickness uniformity and flatness
Good drilling & lamination processes friendly
Superior dielectric thickness control
Property Typical Values
Tg (DMA) 190°C
Tg (TMA) 165°C
Td (TGA) 390°C
CTE z-axis (50 to 260 °C) 2.1%
T-260/ T288 >60 min/ >20 min
Permittivity (RC 50%) @1GHz 4.4
Loss Tangent (RC 50%) @1GHz 0.010
Industry Approvals
IPC-4101 Type Designation : /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade: FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Prepregs: Available in roll or panel form
Glass Styles: 106 and 1080, other prepreg grades are available upon request