High-Tg Thermal Resistance Laminate and Prepreg
Core: TU-722; Prepreg: TU-72P

TU-722/TU-72P laminate/ prepreg offer enhanced thermal resistance and also provide UV-block characteristic and compatibility with AOI process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. The lower Z-axis thermal expansion also minimizes the problems, such as lifted pads and barrel cracks. TU-722 laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and with general CAF resistance property.

Main Applications
Office Routers
Server, workstation
Key Features
Lead free process compatible
Anti-CAF capability
Superior dimensional stability, thickness uniformity and flatness
Good drilling processability
Excellent through-hole and soldering reliability
High interlayer bonding strength with optimum resin flow
Superior dielectric thickness control
Wide processing window for maximum lamination performance
Excellent thermal and chemical resistance
Compatible with AOI process with UV-block property
Higher Tg characteristics
Reduced Z-axis thermal expansion
Property Typical Values
Tg (DMA) 185°C
Tg (DSC) 175°C
Tg (TMA) 165°C
Td (TGA) 330°C
CTE z-axis (50 to 260 °C) 3.5%
T-260/ T288 >30 min/ >5min
Permittivity (RC 50%) @1GHz 4.2
Loss Tangent (RC 50%) @1GHz 0.016
Industry Approvals
IPC-4101 Type Designation : /21, /24, /26, /28, /121, /124
UL Designation - ANSI Grade: FR-4.0
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5oz (HTE) for built-up; 1/8 to 12oz (HTE) for double sides and H to 2oz (MLS)
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.