TU-872 SLK Sp

Low Dk/Df and High Thermal Reliability Material
Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

Main Applications
Radio Frequency
Backpanel, High performance computing
Line cards, Storage
Servers, Telecom, Base station
Office Routers
Key Features
Excellent electrical properties
Dielectric constant less than 3.5
Dissipation factor less than 0.010
Excellent, stable and flat Dk/Df performance
Compatible with most FR-4 processes
Lead free process compatible
Improved z-axis thermal expansion
Anti-CAF capability
Superior dimensional stability, thickness uniformity and flatness
Excellent through-hole and soldering reliability
Property Typical Values
Tg (DMA) 220°C
Tg (DSC) 200°C
Tg (TMA) 190°C
Td (TGA) 340°C
CTE z-axis (50 to 260 °C) 2.7%
T-260/ T288 60 min/ 20 min
Permittivity (RC 50%) @10GHz 3.5
Loss Tangent (RC 50%) @10GHz 0.008
Industry Approvals
IPC-4101 Type Designation : /29, /98, /99, /101, /126
IPC-4101E/126 Validation Services QPL Certified
UL Designation - ANSI Grade: FR-4.0
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
Prepregs: Available in roll or panel form
Glass Styles: 106, 1080 and 2116